IPC-A-610G Module Breakdown

IPC-A-610 CIS is a modular theory-based course designed to teach the inspection standards for electronic assemblies. Successful completion grants the individual with the Application Specialist Certification which allows them to inspect assemblies in accordance with this standard to meet customer needs.
There is 1 mandatory module and 7 optional ones. The optional modules can be chosen depending on company requirements and can be added in any time if necessary during the 2-year certification period, although the certification on all modules expires at the same time (2 years after the date at which the mandatory module was completed).
The following section provides a breakdown of the content of each of the modules. A multiple-choice exam needs to be successfully completed at the end of each module to allow inspection of these subjects.
IPC Pre-course (mandatory)
IPC Essentials:

  • The IPC Essentials training module covers the essential features of the electronics industry, including its history, the development and practical application of standards, and the importance of certification to you and your company. This 2-hour, online course is divided into 5 sections and includes interactive quizzes to help you master concepts and assess your progress.

IPC Enhanced policies and procedures:

  • The Enhanced Policy and Procedures training module provides an overview of the Policies and Procedures that govern IPC Professional Training and Certification. This module covers restrictions, recertification, testing, and other important information contained in revision 6 of the IPC Policies and Procedures document. It also includes instructions on how to access and use the IPC Online Certification Portal.


Mandatory Module

Module 1 – Introduction, Foreword, Applicable documents and handling

  • Information about the 610 standard including scope, purpose, specialised designs, terms and definitions, examples and illustrations, inspection methodology, verification of dimensions, magnification aids and lighting.
  • Applicable documents – IPC, joint industry standards etc.
  • Handling electronic assemblies including EOS/ESD prevention, EOS/ESD safe workstation/EPA and handling considerations (damage, contamination etc)

Optional Modules

Module 2 – Soldering

  • Soldering acceptability requirements
  • Soldering anomalies e.g. non-wetting, disturbed solder
  • High voltage – terminals, solder cups, insulation, through-hole connections, flared flange terminals and other hardware.

Module 3 – Component damage, printed circuit boards and cleanliness

  • Component Damage
    • Loss of Metallization
    • Chip Resistor Element
    • Leaded/Leadless Devices
    • Ceramic Chip Capacitors
    • Connectors
    • Relays
    • Transformer Core Damage
    • Connectors, Handles, Extractors and Latches
    • Edge Connector Pins
    • Press Fit Pins
    • Backplane Connector Pins
    • Heat Sink Hardware
    • Threaded Items and Hardware
  • Printed Circuit Boards and Assemblies
    • Non-soldered Contact Areas
    • Laminate Conditions
    • Conductors / Lands
    • Flexible and Rigid-Flex Printed Circuitry
    • Marking
    • Cleanliness
    • Solder Mask Coating
    • Conformal Coating
    • Encapsulation


Module 4 – Terminal connections (requires module 2 prior to taking this module)

  • Edge Clip
  • Swaged Hardware
  • Wire/Lead Preparation, Tinning
  • Lead Forming - Stress Relief
  • Service Loops
  • Stress Relief Lead/Wire Bend
  • Lead/Wire Placement
  • Insulation
  • Conductor
  • Terminals - Solder
  • Conductor - Damage - Post-Solder

Module 5 – Through-hole Technology (requires modules 2 & 3 prior to taking this module)

  • Component Mounting
  • Component Securing
  • Unsupported Holes
  • Supported Holes
  • Jumper Wires


Module 6 – Surface mount assemblies (requires modules 2 & 3 prior to taking this module)

  • Staking Adhesive
  • SMT Leads
  • SMT Connections
    • Chip Components - Bottom Only Terminations
    • Chip Components - Rectangular or Square End Components - 1, 3 or 5 Side Termination
    • Cylindrical End Cap Termination
    • Castellated Terminations
    • Flat Gull Wing Leads
    • Round or Flattened (Coined) Leads
    • J Leads
    • Butt/I Joints
    • Flat Lug Leads
    • Tall Profile Components Having Bottom Only Terminations
    • Inward Formed L-Shaped Ribbon Leads
    • Surface Mount Area Array (e.g. BGA)
    • Bottom Termination Components
    • Components with Bottom Thermal Plane Terminations (D-Pak)
    • Flattened Post Connections
    • P-Style Connections
    • Specialised SMT Terminations
    • Surface Mount Connectors
  • Jumper Wires

Module 7 – Hardware

  • Hardware installation (clearance, torque etc)
  • Jackpost mounting
  • Connector pins
  • Wire bundle securing
  • Wire routing


Module 8 – Solderless wire wrap

  • Number of Turns
  • Turn Spacing
  • End Tails, Insulation Wrap
  • Raised Turns Overlap
  • Connection Position
  • Wire Dress
  • Wire Slack
  • Wire Plating
  • Damaged Insulation
  • Damaged Conductors & Terminals