610E modules

IPC-A-610E Module Breakdown

Mandatory Modules

Module 1 Introduction / IPC professional policies and procedures

  • Course overview including testing requirements
  • Certification information
  • IPC policies and procedures

Module 2 Foreword, Applicable documents and handling

  • Information about the 610 standard including scope, purpose, specialised designs, terms and definitions, examples and illustrations, inspection methodology, verification of dimensions, magnification aids and lighting.
  • Applicable documents IPC, joint industry standards etc.
  • Handling electronic assemblies including EOS/ESD prevention, EOS/ESD safe workstation/EPA and handling considerations (damage, contamination etc)

Optional Modules

Module 3 Hardware Installation

  • Hardware installation (clearance, torque etc)
  • Jackpost mounting
  • Connector pins
  • Wire bundle securing
  • Wire routing

Module 4 Soldering

  • Soldering acceptability requirements
  • Soldering anomalies e.g. non-wetting, disturbed solder
  • High voltage terminals, solder cups, insulation, through-hole connections, flared flange terminals and other hardware.

Module 5 Terminal connections (requires modules 4 & 8 prior to taking this module)

  • Edge Clip
  • Swaged Hardware
  • Wire/Lead Preparation, Tinning
  • Lead Forming - Stress Relief
  • Service Loops
  • Stress Relief Lead/Wire Bend
  • Lead/Wire Placement and soldering to turret, bifurcated, pierced/perforated, hook, slotted and solder cups
  • Insulation (damage and clearance)
  • Conductor (deformation, strand damage and tinning)

Module 6 Through-hole Technology (requires modules 4 & 8 prior to taking this module)

  • Component Mounting
  • Component Securing
  • Unsupported Holes
  • Supported Holes
  • Jumper Wires relating to through-hole only

Module 7 Surface mount assemblies (requires module 4 prior to taking this module)

  • Staking Adhesive
  • SMT leads - damage and flattening
  • SMT Connections
    • Chip Components - Bottom Only Terminations
    • Chip Components - Rectangular or Square End Components - 1, 3 or 5 Side Termination
    • Cylindrical End Cap Termination
    • Castellated Terminations
    • Flat Ribbon, L, and Gull Wing Leads
    • Round or Flattened (Coined) Leads
    • J Leads
    • Butt/I Joints
    • Flat Lug Leads
    • Tall Profile Components Having Bottom Only Terminations
    • Inward Formed L-Shaped Ribbon Leads
    • Surface Mount Area Array
    • Plastic Quad Flat Pack-No Leads (PQFN)
    • Components with Bottom Thermal Plane Terminations (D-Pak)
    • Flattened post connections
    • Specialised SMT Terminations
  • Jumper Wires relating to surface mount only

Module 8 Component damage and printed circuit boards and assemblies

  • Printed Circuit Boards and Assemblies
    • Gold Surface Contact Area
    • Laminate Conditions
    • Conductors/Lands
    • Flexible and Rigid-Flex printed circuitry
    • Marking
    • Cleanliness
    • Coatings
    • Encapsulation
  • Component Damage
    • Loss of Metallization
    • Chip Resistor Element
    • Leaded/Leadless Devices
    • Ceramic Chip Capacitors
    • Connectors
    • Relays
    • Transformer Core Damage
    • Connectors, Handles, Extractors and Latches
    • Edge Connnector Pins
    • Press Fit Pins
    • Backplane Connector Pins
    • Heatsink Hardware

Module 9 Solderless wire wrap

  • Number of Turns
  • Turn Spacing
  • End Tails, Insulation Wrap
  • Raised Turns Overlap
  • Connection Position
  • Wire Dress
  • Wire Slack
  • Wire Plating
  • Damaged Insulation
  • Damaged Conductors & Terminals

 

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