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IPC-A-610E Module Breakdown
Mandatory Modules
Module 1 – Introduction / IPC professional policies and procedures
- Course overview including testing requirements
- Certification information
- IPC policies and procedures
Module 2 – Foreword, Applicable documents and handling
- Information about the 610 standard including scope, purpose, specialised designs, terms and definitions, examples and illustrations, inspection methodology, verification of dimensions, magnification aids and lighting.
- Applicable documents – IPC, joint industry standards etc.
- Handling electronic assemblies including EOS/ESD prevention, EOS/ESD safe workstation/EPA and handling considerations (damage, contamination etc)
Optional Modules
Module 3 – Hardware Installation
- Hardware installation (clearance, torque etc)
- Jackpost mounting
- Connector pins
- Wire bundle securing
- Wire routing
Module 4 – Soldering
- Soldering acceptability requirements
- Soldering anomalies e.g. non-wetting, disturbed solder
- High voltage – terminals, solder cups, insulation, through-hole connections, flared flange terminals and other hardware.
Module 5 – Terminal connections (requires modules 4 & 8 prior to taking this module)
- Edge Clip
- Swaged Hardware
- Wire/Lead Preparation, Tinning
- Lead Forming - Stress Relief
- Service Loops
- Stress Relief Lead/Wire Bend
- Lead/Wire Placement and soldering to turret, bifurcated, pierced/perforated, hook, slotted and solder cups
- Insulation (damage and clearance)
- Conductor (deformation, strand damage and tinning)
Module 6 – Through-hole Technology (requires modules 4 & 8 prior to taking this module)
- Component Mounting
- Component Securing
- Unsupported Holes
- Supported Holes
- Jumper Wires relating to through-hole only
Module 7 – Surface mount assemblies (requires module 4 prior to taking this module)
- Staking Adhesive
- SMT leads - damage and flattening
- SMT Connections
- Chip Components - Bottom Only Terminations
- Chip Components - Rectangular or Square End Components - 1, 3 or 5 Side Termination
- Cylindrical End Cap Termination
- Castellated Terminations
- Flat Ribbon, L, and Gull Wing Leads
- Round or Flattened (Coined) Leads
- J Leads
- Butt/I Joints
- Flat Lug Leads
- Tall Profile Components Having Bottom Only Terminations
- Inward Formed L-Shaped Ribbon Leads
- Surface Mount Area Array
- Plastic Quad Flat Pack-No Leads (PQFN)
- Components with Bottom Thermal Plane Terminations (D-Pak)
- Flattened post connections
- Specialised SMT Terminations
- Jumper Wires relating to surface mount only
Module 8 – Component damage and printed circuit boards and assemblies
- Printed Circuit Boards and Assemblies
- Gold Surface Contact Area
- Laminate Conditions
- Conductors/Lands
- Flexible and Rigid-Flex printed circuitry
- Marking
- Cleanliness
- Coatings
- Encapsulation
- Component Damage
- Loss of Metallization
- Chip Resistor Element
- Leaded/Leadless Devices
- Ceramic Chip Capacitors
- Connectors
- Relays
- Transformer Core Damage
- Connectors, Handles, Extractors and Latches
- Edge Connnector Pins
- Press Fit Pins
- Backplane Connector Pins
- Heatsink Hardware
Module 9 – Solderless wire wrap
- Number of Turns
- Turn Spacing
- End Tails, Insulation Wrap
- Raised Turns Overlap
- Connection Position
- Wire Dress
- Wire Slack
- Wire Plating
- Damaged Insulation
- Damaged Conductors & Terminals
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