J-STD-001 Modules

Module 1 Introduction, Policies and Procedures, J-STD-001 Overview (mandatory)

The topics covered in this module are:

    • Introduction
    • IPC Professional Training and Certification Policies and Procedures
    • General Requirements
    • Applicable Documents
    • Material, Components and Equipment Requirements
    • General Soldering and Assembly Requirements
    • Cleaning Process Requirements Introduction
  • Module 2 Wires and Terminals (optional)

    The topics covered in this module are:

      • Wire and Cable Preparation
      • Terminal installation and damage
      • Mounting to terminals
      • Soldering to terminals
  • The following types of terminals are covered theoretically and practically:
      • Bifurcated Terminals
      • Turret Terminals
      • Slotted Terminals (theory only)
      • Hook Terminals
      • Pierced or Perforated Terminals
      • Cup & Hollow Cylindrical Terminals
  • Module 3 Through-Hole Mounting and Terminations (optional)

    The topics covered in this module are:

      • Lead prep
      • Lead damage
      • Lead protrusion, solder criteria
        • Supported holes
        • Unsupported holes
      • Intrusive soldering (pin in paste)
  • Module 4 Surface Mounting of Components (optional)

    The topics covered in this module are:

    • Lead Prep
      • Mounting Requirements
      • Process Considerations
      • Solder Fillet Requirements
  • The following termination styles are covered:
      • Bottom Only Terminations (theory only)
      • Chip Components (1, 3 or 5 Sided Terminations)
      • Cylindrical End Cap Terminations (MELF)
      • Castellated Terminations (theory only)
      • Gull Wing Leads
      • Round or Flattened Leads (theory only)
      • J Leads
      • Butt Connections (theory only)
      • Flat Lug Leads (theory only)
      • Tall Profile Components W/Bottom only Terminations (theory only)
      • Inward Formed L-Shaped Ribbon Leads (theory only)
      • Surface Mount Area Array Packages (BGA) (theory only)
      • Quad Flat Pack (No Leads) QFNL, PQFN, Micro-lead frame (theory only)
      • Components with Bottom Thermal Plane Terminations (D-PAK®) (theory only)
  • Module 5 Inspection Methodology (optional)

    The topics covered in this module are:

    • Hardware Defects Requiring Disposition
    • Inspection Methodology
    • Process Control Requirements
    • Statistical Process Control
    • Wire and Terminal Requirements
    • Through-Hole Requirements
    • SMT Requirements
    • PCB Requirements
    • Conformal Coating and Encapsulation Requirements
  • There is a theory exam at the end of each module. In addition, there are practical workmanship exams at the end of each of the optional modules 2, 3 and 4. At the end of module 5 there is a practical assessment of defects on populated boards provided.

     

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