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Module 1 – Introduction, Policies and Procedures, J-STD-001 Overview (mandatory)
The topics covered in this module are:
- Introduction
- IPC Professional Training and Certification Policies and Procedures
- General Requirements
- Applicable Documents
- Material, Components and Equipment Requirements
- General Soldering and Assembly Requirements
- Cleaning Process Requirements Introduction
Module 2 – Wires and Terminals (optional)
The topics covered in this module are:
- Wire and Cable Preparation
- Terminal installation and damage
- Mounting to terminals
- Soldering to terminals
The following types of terminals are covered theoretically and practically:
- Bifurcated Terminals
- Turret Terminals
- Slotted Terminals (theory only)
- Hook Terminals
- Pierced or Perforated Terminals
- Cup & Hollow Cylindrical Terminals
Module 3 – Through-Hole Mounting and Terminations (optional)
The topics covered in this module are:
- Lead prep
- Lead damage
- Lead protrusion, solder criteria
- Supported holes
- Unsupported holes
- Intrusive soldering (pin in paste)
Module 4 – Surface Mounting of Components (optional)
The topics covered in this module are:
- Lead Prep
- Mounting Requirements
- Process Considerations
- Solder Fillet Requirements
The following termination styles are covered:
- Bottom Only Terminations (theory only)
- Chip Components (1, 3 or 5 Sided Terminations)
- Cylindrical End Cap Terminations (MELF)
- Castellated Terminations (theory only)
- Gull Wing Leads
- Round or Flattened Leads (theory only)
- “J” Leads
- Butt Connections (theory only)
- Flat Lug Leads (theory only)
- Tall Profile Components W/Bottom only Terminations (theory only)
- Inward Formed L-Shaped Ribbon Leads (theory only)
- Surface Mount Area Array Packages (BGA) (theory only)
- Quad Flat Pack (No Leads) QFNL, PQFN, Micro-lead frame (theory only)
- Components with Bottom Thermal Plane Terminations (D-PAK®) (theory only)
Module 5 – Inspection Methodology (optional)
The topics covered in this module are:
- Hardware Defects Requiring Disposition
- Inspection Methodology
- Process Control Requirements
- Statistical Process Control
- Wire and Terminal Requirements
- Through-Hole Requirements
- SMT Requirements
- PCB Requirements
- Conformal Coating and Encapsulation Requirements
There is a theory exam at the end of each module. In addition, there are practical workmanship exams at the end of each of the optional modules 2, 3 and 4. At the end of module 5 there is a practical assessment of defects on populated boards provided.
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